data sheet a207b/srg.3g.srg-pf doc. no : qw0905-l rev. : date : 06 - dec. a - 2005 led array ligitek electronics co.,ltd. property of ligitek only la207b/srg.3g.srg-pf pb lead-free parts
g g sr 1.cathode red 2.common anode 3.3 6.45 0.5 4.3 2.0min 1 2 3 2.54typ 2.0min 18.0min note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. g 0.5 typ 1. 2.common anode 3.cathode green 3 2 1 1.5 max lg2690/r6-pf 3.cathode green 1. 2.common anode 1 23 sr g 2.54typ 1.cathode red 2.common anode 3.cathode green 1 2 3 3.1 2.9 lsrg2692/s55-pf 3.cathode green 23 1 3rd 44 9*4=36 part no. la207b/srg.3g.srg-pf 8.87 11.37 2.54*2=5.08typ + - - ++ 1233 2 12 1 2.9 0.3 1st 2nd srggg package dimensions page 1/6 5.1 0.5 0.5 typ + - - + - - 2 1 3 33 2 1 4th5th 1.6 0.3 6.35 gsrg ligitek electronics co.,ltd. property of ligitek only -
color note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 i fp pd i f tstg t opr symbol typical electrical & optical characteristics (ta=25 ) white diffused gaalas la207b/srg.3g.srg-pf red material part no emitted power dissipation reverse current @5v storage temperature operating temperature parameter peak forward current duty 1/10@10khz forward current part no. typ. 65 luminous intensity @20ma(mcd) 660202.4 1.538 spectral halfwidth nm peak wave length pnm lensmax. forward voltage @ ma(v) min. 20 min. 36 viewing angle 2 1/2 (deg) 100 -40 ~ +100 -40 ~ +85 ir10 ratings g 120 30 mw a ma ma unit ligitek electronics co.,ltd. property of ligitek only page2/6 la207b/srg.3g.srg-pf 30 100 100 sr 2.6 30 5651.7152836 gap green gap green2.6 30 5651.79.02450 green diffused
fig.4 relative intensity vs. temperature 1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 600 0.0 0.5 650700750 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 -40 0.8 -20 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 80 40 20 060100 0.0 2.5 1.5 1.0 2.0 3.0 ambient temperature( ) -40-2002060 40100 80 3.0 2.5 2.0 1.5 1.0 0.5 0.0 ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current typical electro-optical characteristics curve part no. 2.0 fig.1 forward current vs. forward voltage forward voltage(v) 100 f o r w a r d c u r r e n t ( m a ) 1.0 0.1 10 1.0 sr chip 1000 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 3.04.05.0 3/6 page forward current(ma) 1.0101001000 la207b/srg.3g.srg-pf
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip part no. fig.6 directive radiation 4/6 la207b/srg.3g.srg-pf
page 5/6 part no. ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to case) 2.wave soldering profile dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) 260 c3sec max 5 /sec max 260 120 temp( c) time(sec) 150 50 100 2 /sec max 25 0 preheat 0 60 seconds max la207b/srg.3g.srg-pf
mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=230 5 2.dwell time=5 1sec solder resistance test thermal shock test solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. jis c 7021: b-12 mil-std-202:103b jis c 7021: b-11 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 ligitek electronics co.,ltd. property of ligitek only 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) test condition 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) operating life test low temperature storage test high temperature high humidity test high temperature storage test part no. test item reliability test: this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this test is the resistance of the device under tropical for hous. the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. description reference standard page6/6 la207b/srg.3g.srg-pf
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